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Item | Normal capability | Specific capability |
Layer count | Rigid-flex PCB | 2 ~14 | 2 ~24 |
Flex PCB | 1 ~10 | 1 ~12 | |
Board | Min. Thickness | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm |
Max. Thickness | 6mm | 8mm | |
Max. Size | 485mm * 1000mm | 485mm * 1500mm | |
Hole & Slot | Min.Hole | 0.15mm | 0.05mm |
Min.Slot Hole | 0.6mm | 0.5mm | |
Aspect Ratio | 10:01 | 12:01 | |
Trace | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
Tolerance | Trace W / S | ± 0.03mm | ± 0.02mm |
(W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
Hole to hole | ± 0.075mm | ± 0.05mm | |
Hole Dimension | ± 0.075mm | ± 0.05mm | |
Impedance | 0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω | ||
Material | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
Basefilm Main supplier | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
Coverlay Specification | PI : 2mil 1mil 0.5mil | ||
LPI Color | Green / Yellow / White / Black / Blue / Red | ||
PI Stiffener | T : 25um ~250um | ||
FR4 Stiffener | T : 100um ~2000um | ||
SUS Stiffener | T : 100um ~400um | ||
AL Stiffener | T : 100um ~1600um | ||
Tape | 3M / Tesa / Nitto | ||
EMI shielding | Silver film / Copper / Silver ink | ||
Surface finish | OSP | 0.1 - 0.3um | |
HASL | Sn : 5um - 40um | ||
HASL(Leed free) | Sn : 5um - 40um | ||
ENEPIG | Ni : 1.0 - 6.0um | ||
Ba : 0.015-0.10um | |||
Au : 0.015 - 0.10um | |||
Plating hard gold | Ni : 1.0 - 6.0um | ||
Au : 0.02um - 1um | |||
Flash gold | Ni : 1.0 - 6.0um | ||
Au : 0.02um - 0.1um | |||
ENIG | Ni : 1.0 - 6.0um | ||
Au : 0.015um - 0.10um | |||
Immesion silver | Ag : 0.1 - 0.3um | ||
Plating Tin | Sn : 5um - 35um | ||
SMT | Type | 0.3mm pitch Connectors | |
0.4mm pitch BGA / QFP / QFN | |||
0201 Component |
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