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Layer count | 1~42 layers |
Laminates type | FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE, |
Rogers,Aluminium,Berquist, Thermagon,Alon.Polyclad | |
Board thickness | Min. 0.2mm, Max. 8.0mm |
Base copper thickness | Mass production: |
Min: 12um (1/3oz) | |
Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer | |
Prototype: | |
Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer | |
Min finished hole size | By mechanical drilling: 0.15mm (0.006") |
By laser drilling: 0.05mm (0.002") | |
Aspect ratio | 12:01 |
Max panel size | Mass production, 540mm × 740m (21.25" × 29.13") |
Sample: 700mm × 1100mm (27.56" × 43.3") | |
Min line width/space | Mass production: 3mil/3mil |
Prototype: | |
Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025") | |
Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023") | |
Via hole type | Blind/Burried/Plugged |
HDI/Microvia | YES |
Surface finish | HASL / Lead Free HASL |
Immersion Gold / Silver / Tin | |
Flash Gold. Hard Gold plating | |
Selective thick Gold Plating | |
Gold Finger (Gold thickness up to 3um) | |
Plating Silver (Silver through Hole, | |
Carbon ink, Peelable mark, OSP | |
Solder mask | All kinds of colour |
LPI, Dry Film | |
Min S/M pitch (LPI): 0.1mm | |
Impedance Control | Single trace or differential controlled |
50, 60, 70, 100, 110, 120, 130 ±5% | |
Min bonding pitch | 0.181mm (center to center) |
Min SMT pitch | 0.400mm (center to center) |
Min annular ring | 0.025mm |
Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
Tolerances | Min Hole registration tolerance (NPTH) ± 0.025mm |
Min Hole registration tolerance (PTH) ± 0.075mm | |
Min Pattern registration tolerance ± 0.05mm | |
Min S/M registration tolerance (LPI) ± 0.075mm | |
Scoring Lines ± 0.15mm | |
Board thickness (0.1 -1.0mm ) ±15% | |
Board thickness (1.0 -6.35mm ) ±10% | |
Board Size Routed ± 0.1mm | |
Board Size Scored ± 0.2mm | |
Electrical Testing | Voltage 10V - 250V |
Continuity 10-1000 Ohms |
Our Certifications
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