Capability


Item Normal capability Specific capability
Layer count Rigid-flex PCB 2 ~14 2 ~24
Flex PCB 1 ~10 1 ~12
Board Min. Thickness 0.08 +/- 0.03mm 0.05 +/- 0.03mm
Max. Thickness 6mm 8mm
Max. Size 485mm * 1000mm 485mm * 1500mm
Hole & Slot Min.Hole 0.15mm 0.05mm
Min.Slot Hole 0.6mm 0.5mm
Aspect Ratio 10:01 12:01
Trace Min.Width / Space 0.05 / 0.05mm 0.025 / 0.025mm
Tolerance Trace W / S ± 0.03mm ± 0.02mm
(W/S≥0.3mm:±10%) (W/S≥0.2mm:±10%)
Hole to hole ± 0.075mm ± 0.05mm
Hole Dimension ± 0.075mm ± 0.05mm
Impedance 0 ≤ Value ≤ 50Ω : ± 5Ω    50Ω ≤ Value : ± 10%Ω
Material Basefilm Specification PI : 3mil 2mil 1mil 0.8mil 0.5mil
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ
Basefilm Main supplier Shengyi / Taiflex / Dupont / Doosan / Thinflex
Coverlay Specification PI : 2mil 1mil 0.5mil
LPI Color Green / Yellow / White / Black / Blue / Red
PI Stiffener T : 25um ~250um
FR4 Stiffener T : 100um ~2000um
SUS Stiffener T : 100um ~400um
AL Stiffener T : 100um ~1600um
Tape 3M / Tesa / Nitto
EMI shielding Silver film / Copper / Silver ink
Surface finish OSP 0.1 - 0.3um
HASL Sn : 5um - 40um
HASL(Leed free) Sn : 5um - 40um
ENEPIG Ni : 1.0 - 6.0um
Ba : 0.015-0.10um
Au : 0.015 - 0.10um
Plating hard gold Ni : 1.0 - 6.0um
Au : 0.02um - 1um
Flash gold Ni : 1.0 - 6.0um
Au : 0.02um - 0.1um
ENIG Ni : 1.0 - 6.0um
Au : 0.015um - 0.10um
Immesion silver Ag : 0.1 - 0.3um
Plating Tin Sn : 5um - 35um
SMT Type 0.3mm pitch Connectors
0.4mm pitch BGA / QFP / QFN
0201 Component

Our Certifications

  • - Approved UL manufacturer, UL Number: E319737
  • - Certified ISO 9001, TS 16949 and ISO 14001
  • - RoHs compliant
  • - IPC Class 2 & 3
  • - CPCA member
  • Privacy_policy
  •